I received my B.Eng. in Mechatronics Engineering from the School of Mechatronics Engineering, Harbin Institute of Technology (HIT), Harbin, China, in 2018, and my M.Sc. in Mechatronics from the Department of Machine Design, Royal Institute of Technology (KTH), Stockholm, Sweden, in 2019, through 3+2 program.
During September 2019 - October 2020, I worked as a model-in-the-loop (MIL) engineer in ETAS, Robert Bosch GmbH, Shanghai, China.
Since December 2020, I am working towards my Ph.D. degree in the Unit of Mechatronics and Embedded Control Systems, KTH, under spervision of Prof. Lei Feng.
My research interests include convex optimization, reinforcement learning, and optimal filtering, focusing on the application of computational offloading and multi-agent coordination by edge computing in the fields of intelligent transportation systems and soft robotics.
Updates
- Mar., 2024 - I am granded a travel scholarship from The Jubilee appropriation (Jubileumsanslaget) from the Knut and Alice Wallenbergs Foundation to the IEEE ITSC 2024.
- Nov., 2023 - I am granded a travel scholarship from the Karl Engvers foundation to the IEEE IROS 2024.
- Aug., 2023 - Our paper on collaborative collision avoidance of connected vehicles using ADMM with PI-regulated Lagrangian multipliers is presented in the IEEE CASE 2023.
- July, 2023 - I am selected as a IEEE RAS Travel Grant Awardee for the IEEE CASE 2023.
- May, 2023 - Our paper on edge-enabled adaptive shape estimation of 3D printed soft actuators with Gaussian Processes and Unscented Kalman Filters is accepted for publishing in IEEE T-IE.
- Nov., 2022 - I am granded a travel scholarship from the Karl Engvers foundation to the IEEE IV 2023.
- Aug., 2022 - Our paper on decentralized convex optimization for joint task offloading and resource allocation of vehicular edge computing systems is accepted for publishing in IEEE T-VT.
- June, 2022 - Our paper on shape estimation of a 3D printed soft sensor using Kalman filter is accepted for publishing in IEEE RA-L and is joint-presented in the IEEE CASE 2022.